Soitec announces volume manufacturing of 300-mm RF-SOI susbtrates for the growing 4G/LTE-Advanced mobile communications market

Bernin (Grenoble), France, February 18, 2016 — Soitec (Euronext), a world leader in manufacturing
innovative semiconductor materials and a supplier of wafers for radio-frequency silicon-on-insulator (RF-
SOI) applications, has begun mass production of 300-mm RF-SOI substrates for mobile communications.
The 300-mm version of Soitec’s RFeSI90 substrate is made possible by the company’s proprietary
technologies, long-time experience with 200-mm RF-SOI and 300-mm high-volume manufacturing
expertise. These advanced wafers open the door for new enhancements that enable more highly integrated
ICs for 4G/LTE-Advanced communications and the next generation of wireless technologies, including
5G.

This announcement comes at the same time as Soitec reports cumulative sales of one million 200-mm
RF-SOI wafers since 2009, hitting a milestone that underscores the pivotal role of RF-SOI in the booming
wireless communications market. The one million RF-SOI wafers manufactured and shipped by Soitec
have yielded approximately 20 billion ICs for front-end modules (FEMs). Soitec’s RF-SOI substrates are
now integral in manufacturing antenna switches, antenna tuners, some power amplifiers and WiFi
circuits, meeting the demanding requirements of leading-edge smart phone ICs. They have been widely
adopted by leading RF semiconductor companies to address cost, performance and integration needs for
the 3G and 4G/LTE mobile wireless markets.

“The widespread use of Soitec’s materials technology in existing 3G and 4G portable communications
demonstrates the important role of RF-SOI in high-volume, cost-sensitive applications such as cellular
phones, tablets and other fast-growing markets involving mobile internet devices,” said Bernard Aspar,
senior vice president of Soitec’s Communication & Power Business Unit. “Now the high-volume
availability of our newest 300-mm RF-SOI offering enables our customers and their customers to
continue to deliver higher performance while giving them access to foundries’ larger global production
capacities and more manufacturing flexibility.”

While Soitec has been shipping large volumes of 200-mm RF-SOI wafers for many years and continuing
to increase its 200-mm production capacity, the company has been delivering over the past 18 months
300-mm RFeSI90 wafer samples for product qualification. Key partnerships with fabless semiconductor
companies and foundries have been instrumental in achieving the production milestones and performance
levels of Soitec’s new 300-mm RF-SOI product. The large supply of 300-mm wafers allows Soitec’s
customers to expand their production capacities for RF-SOI devices and produce more highly integrated
ICs.

The new wafers – based on a more advanced SOI process – offer higher levels of performance such as
better uniformity, a key parameter in achieving greater control of transistor matching for analog
semiconductor designs and allowing designs with thinner transistors and additional process options to
improve RonCoff performance, the figure of merit that is used to rate the performance of an RF switch.
Soitec continues to work on future generations of RF-SOI substrates with a product roadmap to further
enable more innovation and cost effectiveness for future mobile communication markets.

About Soitec: Soitec (Euronext, Tech 40 Paris) is a world leader in designing and manufacturing
innovative semiconductor materials. The company uses its unique technologies and semiconductor
expertise to serve the electronics and energy markets. With 3,600 patents worldwide, Soitec’s strategy is
based on disruptive innovation to answer its customers’ needs for high performance, energy efficiency
and cost competitiveness. Soitec has manufacturing facilities, R&D centers and offices in Europe, the
U.S. and Asia. For more information, please visit www.soitec.com and follow us on Twitter:
@Soitec_EN