NOVASiC: Expert in reclaiming & wafering services for high-quality, wide-bandgap materials.
With over 25 years of experience, NOVASiC delivers specialized wafering and reclaim services for wide-bandgap semiconductor wafers.
This comprehensive offering enables NOVASiC to support diverse projects, from industrial-scale applications to precise, small-scale research initiatives.
Up to 10 times
A minimum of 10µm is removed in addition to the epitaxial layer, in function of the initial epitaxy thickness and the quality of the thickness reporting.
IEDM 2025
Substrate Vision Summit 2025
RF-SOI & FD-SOI Symposium
Soitec's technological innovation is focused on providing engineered substrates and advanced materials solutions that will drive the future of energy-efficient electronics